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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : Preliminary Data Issued Date : 2001.03.01 Revised Date : 2001.03.29 Page No. : 1/3 HTL295D PNP EPITAXIAL PLANAR TRANSISTOR Description The HTL295D is designed for high voltage low power switching applications especially for use in telephone and telecommunication circuits. Absolute Maximum Ratings * Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature ..................................................................................... 150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ................................................................................... 1.5 W * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ..................................................................................... -500 V VCEO Collector to Emitter Voltage .................................................................................. -500 V VEBO Emitter to Base Voltage ............................................................................................ -6 V IC Collector Current ..................................................................................................... -250 mA Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO ICES IEBO *VCE(sat)1 *VCE(sat)2 *VCE(sat)3 *VBE(sat) *hFE1 *hFE2 *hFE3 fT Cob Min. -500 -500 -6 50 60 50 10 Typ. Max. -1 -10 -0.2 -500 -2 -3 -750 250 30 Unit V V V uA uA uA mV V V mV Test Conditions IC=-100uA, IE=0 IC=-1mA, IB=0 IE=-10uA VCB=-500V, IE=0 VCE=-500V, IB=0 VEB=-6V, IC=0 IC=-10mA, IB=-1mA IC=-50mA, IB=-5mA IC=-80mA, IB=-4mA IC=-10mA, IB=-1mA VCE=-10V, IC=-1mA VCE=-10V, IC=-20mA VCE=-10V, IC=-80mA VCE=-20V, IE=-10mA, f=1MHz VCB=-20V, f=1MHz, IE=0 MHz pF *Pulse Test : Pulse Width 380us, Duty Cycle2% HTL295D HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 100000 Spec. No. : Preliminary Data Issued Date : 2001.03.01 Revised Date : 2001.03.29 Page No. : 2/3 Sasturation Voltage & Collector Current 100 hFE @ VCE=10V Saturation Voltage (mV) 10000 hFE 1000 VCE(sat) @ IC=20IB 100 VCE(sat) @ IC=10IB 10 0.1 1 10 100 1000 10 1 10 100 1000 Collector Current-IC (mA) Collector Current-IC (mA) Saturation Voltage & Collector Current 1000 100 Capacitance & Reverse-Biased Voltage SATURATION VOLTAGE-(mV) VBE(sat) @ IC=10IB Cob Capacitance (pF) 100 1 10 100 1000 10 1 0.1 1 10 100 Collector Current-IC (mA) Reverse Biased Voltage (V) Safe Operating Area 10 1.6 1.4 PT=1mS Power Derating PD(W) , Power Dissipation 100 1000 Collector Current-IC (A) 1.2 1 0.8 0.6 0.4 0.2 1 PT=100mS PT=1S 0.1 0.01 1 10 0 0 50 o 100 150 200 Forward Biased Voltage-VCE (V) Ta( C) , Ambient Temperature HTL295D HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-126ML Dimension Marking : Spec. No. : Preliminary Data Issued Date : 2001.03.01 Revised Date : 2001.03.29 Page No. : 3/3 A B D E F 3 2 I G 1 J M L K O H HSMC Logo Part Number Date Code Product Series Rank Ink Marking C Style : Pin 1.Emitter 2.Collector 3.Base N 3-Lead TO-126ML Plastic Package HSMC Package Code : D *:Typical DIM A B C D E F G H Inches Min. Max. 0.1356 0.1457 0.0170 0.0272 0.0344 0.0444 0.0501 0.0601 0.1131 0.1231 0.0737 0.0837 0.0294 0.0494 0.0462 0.0562 Millimeters Min. Max. 3.44 3.70 0.43 0.69 0.87 1.12 1.27 1.52 2.87 3.12 1.87 2.12 0.74 1.25 1.17 1.42 DIM I J K L M N O Inches Min. Max. *0.1795 0.0268 0.0331 0.5512 0.5906 0.2903 0.3003 0.1378 0.1478 0.1525 0.1625 0.0740 0.0842 Millimeters Min. Max. *4.56 0.68 0.84 14.00 15.00 7.37 7.62 3.50 3.75 3.87 4.12 1.88 2.14 Notes : 1.Dimension and tolerance based on our Spec. dated Mar. 6,1995. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : * Lead : 42 Alloy ; solder plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : * Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 HTL295D HSMC Product Specification |
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